| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology which easily forms a heat sink. SOLUTION: A semiconductor module 10 includes heat sinks 14 and semiconductor elements 12 which are adhered to one surface 14e of the heat sink 14. Partial grooves 14a and partially protruding parts 14b are formed on the one surface 14e of the heat sink 14. Each partial groove 14a extends along an outer periphery of the semiconductor element 12. Each partially protruding part 14b extends along the partial groove 14a. Thus, it is possible to reduce the number of groove parts (recessed parts) compared to a case where the outer periphery of the semiconductor element is enclosed by hole-like recessed parts. COPYRIGHT: (C)2013,JPO&INPIT |
