| 摘要 |
A semiconductor device includes a substrate having bumps on the backside thereof, a first semiconductor chip mounted on the surface of the substrate, a second semiconductor chip mounted on the first semiconductor chip above the surface of the substrate, a first bonding wire having a length L1 for connecting the first semiconductor chip to the substrate, a second bonding wire having a length L2 (where L2>L1) for connecting the second semiconductor chip to the substrate, a first resin seal having a dielectric constant ∈1 for sealing the first bonding wire, and a second resin seal having a dielectric constant ∈2 (where ∈2<∈1) for sealing the second bonding wire. The relationship between the lengths L1 and L2 and the dielectric constants ∈1 and ∈2 is defined by an equation of ∈1=∈2(L2/L1)2. |
