| 摘要 |
<p>In a connection structure that is applied to the case of mounting of electronic parts or via connection, in which a first connecting object is connected to a second connecting object by using a solder, joint reliability after thermal shock is enhanced. The connection structure is configured so as to form a region (9) where at least a Cu-Sn intermetallic compound, a M-Sn intermetallic compound (M is Ni and/or Mn) and a Cu-M-Sn intermetallic compound exist in a cross-section of a connecting part (4) when the cross-section of the connecting part (4) is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part (4) is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all squares except for squares in which only a Sn-based metal component exists in one square is 70% or more.</p> |
