| 摘要 |
The present invention relates to a method for manufacturing a printed circuit board. The method includes a first coating layer forming step of forming a first coating layer on one side of a board with conductive ink; a second coating layer forming step of forming a second coating layer on the other side of the board with the conductive ink; a boring step of forming a through hole by boring the first coating layer, the board, and the second coating layer; and a plating step of forming a plated layer by plating the first and second coating layers and an inner surface of the through hole. Thus, according to the present invention, provided are a method for manufacturing a printed circuit board and a printed circuit board capable of improving productivity, reducing processes, and saving raw materials while improving the electrical property and a limit of forming a precise circuit pattern which an existing circuit forming process in an existing printing method has, through an existing photolithograph process. |
