SEMICONDUCTOR-WAFER-SURFACE-PROTECTIVE ADHESIVE TAPE

摘要

A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10mum or more, the surface free energy (gammas) of the surface of the adhesive layer is 30-35 mN/m, the contact angle (thetal I) in relation to diiodomethane is 54-60°, the adhesive force in relation to an SUS280 polished surface at 23°C is 0.8-4.3 N/25mm, and the adhesive force in relation to the SUS280 polished surface when heat-releasing at 50°C in comparison to the adhesive force when releasing at 23°C is 50% or less.