| 摘要 |
According to the present invention, a thin substrate is easily separated from a support substrate by vacuum release. Under atmospheric pressure, a hole is opened by inserting a penetrating member in at least a portion of a seal member (3) of a bonded substrate (4). Thereby, enclosure of a vacuum space (S), formed by enclosing the inside of the seal member (3) to be in a vacuum state, is destroyed; fluid such as air or liquid enters in the vacuum space (S); and then the vacuum space (S) is exposed to the air. Consequently, both an inner side and an outer side of the seal member (3) are pressed by atmospheric pressure from the outside and pressure of the fluid entering into the vacuum space, and the seal member (3) becomes thin. Therefore, the thin substrate can be separated from the support substrate (2) without being deformed. |
