TRANSFER PRINTING SUBSTRATE, MENUFACTURING METHOD THEREOF, AND METHOD OF TRANSFER PRINTING

摘要

A transfer printing technology is provided. A transfer printing substrate comprises multiple column structures and a sacrificial layer spread on the column structures. The regular alignment of a transfer layer is performed by the structural restraint caused by the concave structure, which is formed on the column structures and the bottom surface of the transfer layer corresponding to the column structures, or the chemical bonding of the column structures and the transfer layer. In the regular alignment caused by the structural constraint, the remaining sacrificial layer can be used as a bonding element. The transferring process is performed by the separation of the adhesion by the sacrificial layer, the cutting of the column structures when the column structures and the transfer layer are chemically bonded, or the separation of the adhesion between the column structures and a handling substrate. The transfer printing substrate and a transfer printing method using the same have high alignment degrees and transfer yields and transfer a flexible ultra thin element to various transfer surfaces.