发明名称 |
Wafer with recessed plug |
摘要 |
In one embodiment, a method of forming a plug includes providing a base layer, providing an intermediate oxide layer above an upper surface of the base layer, providing an upper layer above an upper surface of the intermediate oxide layer, etching a trench including a first trench portion extending through the upper layer, a second trench portion extending through the oxide layer, and a third trench portion extending into the base layer, depositing a first material portion within the third trench portion, depositing a second material portion within the second trench portion, and depositing a third material portion within the first trench portion. |
申请公布号 |
US8890283(B2) |
申请公布日期 |
2014.11.18 |
申请号 |
US201414173383 |
申请日期 |
2014.02.05 |
申请人 |
Robert Bosch GmbH |
发明人 |
Graham Andrew B.;Yama Gary;O'Brien Gary |
分类号 |
H01L29/00;H01L21/762;B81B7/00;B81C1/00 |
主分类号 |
H01L29/00 |
代理机构 |
Maginot Moore & Beck LLP |
代理人 |
Maginot Moore & Beck LLP |
主权项 |
1. A wafer comprising:
a base layer; an intermediate oxide layer above an upper surface of the base layer; a first upper layer above an upper surface of the intermediate oxide layer; a trench including a first trench portion extending through the first upper layer, a second trench portion extending through the intermediate oxide layer, and a third trench portion extending only partially into the base layer; a plug, the plug including
a first material portion deposited within the third trench portion;a second material portion deposited within the second trench portion; anda third material portion deposited within the first trench portion; and a gap in the intermediate oxide layer, the gap exposing at least a portion of the second material portion. |
地址 |
Stuttgart DE |