Method of bonding a metal to a substrate

摘要

A method of bonding a metal to a substrate is disclosed herein. The method involves forming a nano-brush on a surface of the substrate, where the nano-brush includes a plurality of nano-wires extending above the substrate surface. In a molten state, the metal is introduced onto the substrate surface, and the metal surrounds the nano-wires. Upon cooling, the metal surrounding the nano-wires solidifies, and during the solidifying, at least a mechanical interlock is formed between the metal and the substrate.

主权项

1. A method of bonding a metal to a substrate, comprising:
forming a nano-brush on a surface of the substrate, the nano-brush including a plurality of nano-wires extending above the substrate surface, the forming of the nano-brush including:
forming a plurality of nano-pores in the surface of the substrate;depositing a material into the plurality of nano-pores;growing a nano-wire in each of the plurality of nano-pores from the deposited material; andremoving a portion of the substrate surface to expose the nano-wire grown therein; in a molten state, introducing the metal onto the substrate surface, the metal penetrating spaces between each individual nano-wire in the plurality of nano-wires and surrounding each individual nano-wire in the plurality of nano-wires; and upon cooling, solidifying the metal surrounding each individual nano-wire in the plurality of nano-wires, wherein during the solidifying, forming at least a mechanical interlock between the metal and the substrate.