| 发明名称 | Three-dimensional integrated circuit | ||
| 摘要 | A three-dimensional integrated circuit, including a first adhesive bonding layer, a first chip, a second chip, and an inter-stratum thermal pad, is provided. The first adhesive bonding layer has a first surface and a second surface opposite to each other. The first chip is disposed on the first surface of the first adhesive bonding layer. The first chip includes a hot zone. The second chip is disposed on the second surface of the first adhesive bonding layer. The inter-stratum thermal pad is embedded in the first adhesive bonding layer and faces to the hot zone. | ||
| 申请公布号 | US8890303(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201313831150 | 申请日期 | 2013.03.14 |
| 申请人 | National Chiao Tung University | 发明人 | Tan An-Nan;Chen Hung-Ming |
| 分类号 | H01L23/36;H01L23/367;H01L23/48;H01L25/065;H01L23/42 | 主分类号 | H01L23/36 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A three-dimensional integrated circuit, comprising: a first adhesive bonding layer comprising a first surface and a second surface opposite to each other; a first chip disposed on the first surface of the first adhesive bonding layer and comprising a hot zone; a second chip disposed on the second surface of the first adhesive bonding layer; and an inter-stratum thermal pad embedded in the first adhesive bonding layer and facing to the hot zone. | ||
| 地址 | Hsinchu TW | ||