Method for manufacturing wafer-bonded semiconductor device

摘要

The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process.;In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.

主权项

1. A method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, comprising:
a first step of forming in advance a bonding member having a bonding function when heated on the wafer-bonded surface sides of said first wafer substrate and said second wafer substrate; subsequent to forming the bonding member, a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surface of said bonding member formed in said first step; a third step of causing excitation for starting the reaction of said flux paste supplied in said second step; a fourth step of reacting the flux paste, the reaction of the flux paste being an exothermic reaction; and a fifth step of allowing the bonding member to exhibit its bonding function by heat generated by the exothermic reaction of the flux paste.