Electrode structure and method for forming bump

摘要

An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

主权项

1. A method for assembling electrically conductive bumps, on electrode patterns on a substrate having electrode patterns thereon, with an Ni layer on at least part of each of the electrode patterns, the method comprising:
(a) supplying onto the substrate and the electrode patterns a fluid containing conductive particles and a bubble generating agent; (b) placing a plate member on the fluid on the substrate and the electrode patterns; (c) heating the fluid thereby generating bubbles from the bubble generating agent, the bubbles then causing the conductive particles to collect selectively on each of the electrode patterns; and (d) melting the collected conductive particles and curing the melted conductive particles on the Ni layer on at least part of each of the electrode patterns.