发明名称 PRINTED WIRING BOARD MATERIAL AND PRINTED WIRING BOARD USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a printed wiring board material, having high voltage resistance between circuits, capable of maintaining insulation reliability over a long period of time in a high-definition circuit and a use for a large current and to provide a printed wiring board using the same.SOLUTION: The printed wiring board material includes a cellulose nanofiber, produced from lignocellulose, having a number-average fiber diameter of 3 nm to 1000 nm and a binder component, which may be suitably used for a solder resist, an interlayer insulation material, and a core material. The printed wiring board material is used for the printed wiring board.</p>
申请公布号 JP2014216376(A) 申请公布日期 2014.11.17
申请号 JP20130090377 申请日期 2013.04.23
申请人 TAIYO HOLDINGS CO LTD 发明人 SHIBATA DAISUKE;SUMIYA TAKENORI;ENDO ARATA;USHIKI SHIGERU;MIWA TAKAO
分类号 H05K3/46;C08L97/02;C08L101/00;H05K1/03;H05K3/28 主分类号 H05K3/46
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