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发明名称
中空密封用树脂薄片及中空封装之制造方法
摘要
提供即使中空构造之空隙的宽为100μm左右,亦可维持中空构造,且防止封装翘曲可制作信赖性高的中空封装之中空密封用树脂薄片及中空封装之制造方法。本发明的中空密封用树脂薄片,无机充填剂以70体积%以上90体积%以下的含量含有,且以前述无机充填剂之全量为100体积%时,前述无机充填剂以雷射绕射散射法所测定的粒度分布满足下列条件。超过100μm:1体积%以下 10μm以下:30体积%以上70体积%以下 1μm以下:10体积%以上
申请公布号
TW201443116
申请公布日期
2014.11.16
申请号
TW103111254
申请日期
2014.03.26
申请人
日东电工股份有限公司
发明人
豊田英志;清水佑作;石坂刚
分类号
C08J5/18(2006.01);C08K3/00(2006.01);H01L23/29(2006.01);H01L23/31(2006.01)
主分类号
C08J5/18(2006.01)
代理机构
代理人
<name>林志刚</name>
主权项
地址
日本
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