| 摘要 |
The invention describes a mounting layer (200) for mounting at least two light emitting semiconductor devices. The mounting layer (200) comprises corner protrusion (205) and edge protrusion (210) for aligning the mounting layer (200) to the cooling structure (100). The mounting layer (200) further comprises aligning holes (215) defining mounting areas (270) for mounting the light emitting semiconductor devices. The mounting layer (200) enables, for example, manufacturing of a µ-channel cooler with mounting areas (270) by means of one direct bonding process. Tolerances may thus be reduced. The invention further describes a cooling structure (100) like a µ-channel cooler comprising such a mounting layer (200) and a light emitting structure comprising such a cooling structure (100). Furthermore, methods of manufacturing such a mounting layer (200), cooling structure (100) and light emitting structure are described. |
