APPARATUS AND METHOD FOR TREATING SUBSTRATE

摘要

Disclosed is an apparatus for treating a substrate. The apparatus for treating a substrate includes a load port which processes a substrate in which a wafer with a completed backgrounding process of a mounting tape fixed to a frame ring is attached, and a carrier for receiving substrates is placed on; a plasma processing unit which processes the upper surface of the wafer by supplying plasma; and a substrate transfer unit which transfers the substrate between the carrier and the plasma processing unit.