发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 The plasma processing apparatus is provided with a chamber 11, a plasma source 13 which generates plasma inside the chamber 11, a stage 16 which is provided inside the chamber 11 and places a carrier 5 thereon, a cover 31 which is arranged above the stage 16 to cover a holding sheet 6 and a frame 7 and has a window 33 which is formed on a central part thereof to penetrate the cover 31 in the thickness direction, and a drive mechanism 38 which changes the position of the cover 31 relative to the stage 16 between a first position which is away from the stage 16 and allows the carrier 5 to be placed on and removed from the stage 16 and a second position which allows the cover 31 to cover the holding sheet 6 and the frame 7 of the carrier 5 placed on the stage 16 and a substrate 2 held on the holding sheet 6 to be exposed through the window 33. The window 33 of the cover 31 allows an area of the substrate 2, the area being located on the inner side with respect to an outer edge area of the substrate 2, to be exposed therefrom.
申请公布号 US2014335696(A1) 申请公布日期 2014.11.13
申请号 US201414259450 申请日期 2014.04.23
申请人 Panasonic Corporation 发明人 NISHIZAKI Nobuhiro;HARIKAI Atsushi;IWAI Tetsuhiro;HIROSHIMA Mitsuru
分类号 H01L21/67;H01L21/3065 主分类号 H01L21/67
代理机构 代理人
主权项 1. A plasma processing apparatus performing plasma processing on a substrate held in a carrier including an annular frame and a holding sheet, the plasma processing apparatus comprising: a chamber having a pressure reducible internal space; a plasma source generating plasma inside the chamber; a stage provided inside the chamber, the stage placing the carrier thereon; a cover arranged above the stage to cover the holding sheet and the frame, the cover having a window formed on a central part thereof to penetrate the cover in the thickness direction; and a drive mechanism changing the position of the cover relative to the stage between a first position away from the stage, the first position allowing the carrier to be placed on and removed from the stage, and a second position allowing the cover to cover the holding sheet and the frame of the carrier placed on the stage and the substrate held on the holding sheet to be exposed through the window, wherein the window of the cover allows an area of the substrate, the area being located on the inner side with respect to an outer edge area of the substrate, to be exposed therefrom.
地址 Osaka JP