LAMINATION TECHNICAL DEVELOPMENT OF METAL PRINTED CIRCUIT BOARD HAVING HIGH HEAT-RADIATION PROPERTY

摘要

The present invention relates to a method for manufacturing a metal PCB and, more specifically, to a method for performing optimized anodizing process and electroplating process for manufacturing a metal PCB including an aluminum oxidized layer formed on the surface of the board; a Ni seed layer patterned on the aluminum oxidized layer; and a metal wire formed on the Ni seed layer. The manufactured metal PCB is a high efficiency metal PCB having high withstand voltage and heat radiation properties to be applied to various electronic products.