| 主权项 |
1. An image sensor comprising:
a first semiconductor chip having a first surface and a second surface; a second semiconductor chip having a first surface and a second surface; and a first adhesive layer between the second surface of the first semiconductor chip and the second surface of the second semiconductor chip, the first semiconductor chip being stacked on the second semiconductor chip via the first adhesive layer such that the second surface of the first semiconductor chip faces the second surface of the second semiconductor chip, and a footprint of the first semiconductor chip is larger than a footprint of the second semiconductor chip with respect to a plan view of the image sensor, the first semiconductor chip including an image sensing area, the image sensing area including an array of unit pixels configured to capture light corresponding to an image and to generate image signals based on the captured light, the second surface of the first semiconductor chip including first contact pads connected to the unit pixels, the second semiconductor chip including first peripheral circuits configured to control the array of unit pixels and receive the generated image signals, the first peripheral circuits including a vertical scanning circuit, a horizontal scanning circuit, and a signal read-out circuit, the second surface of the second semiconductor chip including second contact pads connected to the peripheral circuits, and the first contact pads being electrically connected through the first adhesive layer to the second contact pads. |
