| 发明名称 |
METHOD AND APPARATUS FOR MEASURING THICKNESS OF LAYER IN PRINTED CIRCUIT BOARD |
| 摘要 |
A method for testing an electronic device comprises providing a device under test (DUT) defined on a printed circuit board (PCB). The DUT includes a measurement target layer forming part of the PCB, and a transmission line which is in contact with the measurement target layer. The method further comprises applying an electric power to the transmission line, measuring a capacitance of the measurement target layer while the electric power is being applied, and computing a thickness of the measurement target layer based on the measured capacitance. |
| 申请公布号 |
US2014333329(A1) |
申请公布日期 |
2014.11.13 |
| 申请号 |
US201313890508 |
申请日期 |
2013.05.09 |
| 申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
JEONG Jin;CHUNG Chris;KIM Tae Eun |
| 分类号 |
H05K1/02;G01B7/06 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for testing an electronic device, comprising:
providing a device under test (DUT) defined on a printed circuit board (PCB), wherein the DUT includes a measurement target layer forming part of the PCB and further includes a transmission line which is in contact with the measurement target layer, applying an electric power to the transmission line; measuring a capacitance of the measurement target layer while the electric power is being applied; and computing thickness of the measurement target layer based on the measured capacitance. |
| 地址 |
Singapore SG |
