| 摘要 |
PROBLEM TO BE SOLVED: To provide solder paste which can fill a minute opening.SOLUTION: Solder paste is printed on a substrate through a mask member with an opening part formed thereon. The viscous solder paste is supplied to the opening part of the mask member under reduced pressure, and fills an inside of the opening part under atmospheric pressure. The solder paste has preferably 50-150 Pa s of viscosity, and 0.3-0.5 of a thixotropy ratio. The solder paste is produced by mixing a flux containing a solvent having a boiling point for suppressing volatilization under reduced pressure, and solder powder. The solvent of which the boiling point is 240°C or higher is used for the flux, and the solvent is preferably octane diol. |
