发明名称 MASKING TAPE AND SURFACE TREATMENT METHOD FOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide a masking tape which has excellent adhesion at ordinary temperature, exerts high adhesion even in high-temperature water of 80-100°C and is easily peelable after use.SOLUTION: The masking tape is used to protecting a non-plated surface in plating by an electroless plating method or an electrolytic plating method and consists of a substrate and an adhesive layer formed on one side of the substrate, and the substrate has an oxygen permeability of 9 cc/m/hr/atm or lower, measured by JIS K 7126.
申请公布号 JP2014210923(A) 申请公布日期 2014.11.13
申请号 JP20140115169 申请日期 2014.06.03
申请人 SEKISUI CHEM CO LTD 发明人 SUMII YUICHI;SUGITA TAIHEI;MURAYAMA HIROSHI
分类号 C09J7/02;C23C18/18;C25D5/02;C25D7/12;H01L21/02 主分类号 C09J7/02
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