| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board having an improved mechanical strength and improved flexibility; and provide a manufacturing method of the multilayer wiring board.SOLUTION: A multilayer wiring board 100 includes a plurality of printed wiring base materials 10-40 in each of which a wiring pattern and a via are formed on a resin base material and which are laminated in a lamination direction via an adhesive layer 9. The multilayer wiring board 100 has movable parts 80 which are formed on the wiring base materials 10-40 and the adhesive layer 9 around a plurality of multilayer wiring parts 90 arranged at predetermined intervals in planar view and in a matrix, and each of which is composed of an elastic member 82 for linking the plurality of multilayer wiring parts 90 in a manner such that each multilayer wiring part can be displaced in the lamination direction and a surface direction of the printed wiring base materials 40-20, and composed of a space part 83.</p> |
