| 摘要 |
<p>A heat sink (100) for an electronic device comprising a first plate (102), a second plate (104) and a pipe (106). One side of the first plate (102) is in thermal contact with the electronic device. The second plate (104) is in thermal contact with the other side of the first plate (102). Further, the second plate (104) includes a hole and placed such that, a gap for airflow maintained between the first plate (102) and the second plate (104). One end the pipe (106) thermally coupled to the second plate (104). Thus facilitating the air flowing into the pipe (106) through the other end escapes the heat sink through the gap maintained between the first plate (102) and the second plate (104) via the hole on the second plate (104).</p> |
