| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology of joining copper to each other at a relatively low temperature while securing connection reliability.SOLUTION: A metal joining device 1 includes: a solution supply part 10 which supplies a solution which elutes oxide a major component of which is copper oxide to at least either of a first coated part of a first joined part having a first base material part a major component of which is copper and the first coated part a major component of which is copper oxide, and a second coated part of a second joined part having a second base material part a major component of which is copper and the second coated part a major component of which is copper oxide; a pressurizing part 30 which pressurizes the first joined part and the second joined part so as to reduce a distance between the first joined part and the second joined part; and a heating part 50 which heats the first joined part and the second joined part. The metal joining device 1 joins the copper of the first joined part and the copper of the second joined part which are exposed by the solution in a state that the first joined part and the second joined part are pressurized and heated.</p> |
