发明名称 Encapsulant for optoelectronic device
摘要 <p>PURPOSE: A filler for an optoelectronic device is provided to manufacture a solar cell module with excellent release strength, light transmissivity, transparency, etc. CONSTITUTION: A filler for an optoelectronic device contains a silane-modified resin which is formed by polymerizing polyolefin and a silane compound. The density of the polyolefin is 0.865-0.888 g/cc and Vicat softening temperature is 30-64°C. A manufacturing method of the filler comprises: a step of manufacturing the silane-modified resin by melting a mixture of the polyolefin and the silane compound; a step of manufacturing the filler by mixing the silane-modified resin, polyolefin for addition and additives and extruding the mixture thereof.</p>
申请公布号 KR101460843(B1) 申请公布日期 2014.11.12
申请号 KR20110049607 申请日期 2011.05.25
申请人 发明人
分类号 C08L23/26;C08K5/54;C08L23/06;H01L31/048 主分类号 C08L23/26
代理机构 代理人
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