| 摘要 |
A heat sink assembly for dissipating heat from an LED downlight comprises a first body 14 of heat conductive material having a melting point or decomposition point at or below 900°C, the first body having a first end, a second end and at least one sidewall; a second body 9 of heat conductive material having a melting point at or above 900°C, the second body having a first side and a second side; wherein the first side of the second body 9 is adapted to form a thermally conducting fit with the object 7 from which heat is to be dissipated, and the second side of the second body 9 is adapted to form a thermally conducting fit with the first end of the first body 14. |
