| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sapphire substrate processing method which makes it possible to divide a sapphire substrate along a scheduled dividing line by forming a cut groove of a designated depth therein without causing it to chip off. <P>SOLUTION: A sapphire substrate processing method for dividing a sapphire substrate 20 along a scheduled dividing line includes a first cut groove forming step of forming a first cut groove 201 in the sapphire substrate along the scheduled dividing line while rotating a first cutting blade having a first thickness which has diamond abrasive fixed with nickel plating, a second cut groove forming step of forming a second cut groove 202 at the bottom of the first cut groove formed in the sapphire substrate while positioning a second cutting blade having a second thickness smaller than the first thickness at the first cut groove and rotating the second cutting blade therein, and a breaking step of breaking the sapphire substrate along the scheduled dividing line where the first and the second cut grooves are formed by applying an external force thereto. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
