SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Provided are a semiconductor package and a manufacturing method thereof. The semiconductor package according to the present invention comprises a substrate; lower semiconductor chips provided on the inner surface of the substrate; and upper semiconductor chips arranged on the lower semiconductor chips. Connection terminals are installed between the substrate and the lower semiconductor chips and electrically connect the lower semiconductor chips to the substrate. The upper semiconductor chip has the bottom which faces the substrate; and the top facing the bottom. Bonding wires connect the bottom surfaces of the upper semiconductor chips to the outer surface of the substrate through windows.