Composite material and high frequency substrate made therefrom

摘要

The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.

主权项

1. A composite material comprising:
a thermosetting mixture in an amount of 20-70 parts by weight, the thermosetting mixture including a liquid resin containing vinyl in an amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11,000 g/mol, the liquid resin comprising 30%-75% of the weight of the thermosetting mixture, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds having a molecular weight of 5,000-50,000 g/mol;
wherein the solid styryl resin with unsaturated double bonds has the following structure formula: wherein, R is:
—(CH2)X—CH═CH2, or —CH2—C6H4—CH═CH2;X is 1-3;n and m are natural numbers, and m/n=0.8˜9;wherein the solid styryl resin with unsaturated double bonds comprises 25%-70% of the weight of the thermosetting mixture;a fiberglass cloth in an amount of 10-60 parts by weight;a powder filler in an amount of 0-55 parts by weight; anda cure initiator in an amount of 1-3 parts by weight, based on 100 parts by weight of the composite material.