发明名称 |
CRACK FREE SEPARATION METHOD FOR THE ELECTRODEPOSITED THIN FILM AND EVALUATING METHOD OF THE PHYSICAL PROPERTIES FOR THE FILM |
摘要 |
<p>The present invention, as a thin film separating method, is a non-crack separating method of an Electrolysis Deposition film including a step of preparing a flexible substrate for thin film separation; a step of depositing a thin film on the substrate with an electrolysis deposition method; a step of pouring resin on the deposited thin film; and a step of separating the solidified resin and the deposited thin film from the flexible substrate. The present invention has a simple and easy separation process by using the flexible substrate, as compared to a method of separation from an inflexible substrate. And as a physical characteristic about an electrolysis deposition film separated without a crack is evaluated, the physical characteristic is able to be evaluated without a damage problem occurring in the separation process so that a high reliable evaluation result is obtained. And as the thin film on the flexible substrate is able to be separated without a crack, there are excellent effects in terms of shape and quality.</p> |
申请公布号 |
KR101460236(B1) |
申请公布日期 |
2014.11.10 |
申请号 |
KR20130056133 |
申请日期 |
2013.05.20 |
申请人 |
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS |
发明人 |
YOO, BONG YOUNG;PARK, KI MOON;KIM, DONG UK |
分类号 |
H01L21/20;H01L21/288;H01L21/66 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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