| 发明名称 |
AN ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND AN ADHESIVE FILM FOR SEMICONDUCTOR PREPARED FROM THE COMPOSITION |
| 摘要 |
<p>Provided in the present invention are a semiconductor adhesive composition which includes an oligomer repeatedly containing oxygen, nitrogen, sulfur, or phosphor atom or a polymer additive to be combined with a metal ion, or significantly reduces mobility of a metal by oxidizing or reducing the metal ion, to maximize operating efficiency of a semiconductor device during semiconductor process or after the process, and an adhesive film using the same.</p> |
| 申请公布号 |
KR20140129924(A) |
申请公布日期 |
2014.11.07 |
| 申请号 |
KR20130048886 |
申请日期 |
2013.04.30 |
| 申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
YOO, YONG SIK;KIM, JO GYUN;KIM, JIN MAN;YANG, SEUNG YONG;LEE, JUN WOO;CHOI, JAE WON |
| 分类号 |
C09J4/00;C09J7/02;C09J201/00;H01L21/60 |
主分类号 |
C09J4/00 |
| 代理机构 |
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