| 摘要 |
The present invention relates to an interface module for a probe card using a high functional complex textile which uses a high functional complex textile material, rather than a conventional multilayer ceramic or a multilayer polymer resin film, to prevent degradation of endurance due to thermal expansions and contractions, forms a desired microcircuit pattern by forming a conductive member with a good electrical property, which serves as an interface for a probe card, on a surface, and enlarges a small pitch formed at an object to be measured by increasing a circuit line path toward a multilayer printed circuit board layer. In order to accomplish this, according to the present invention, needle blocks and complex textile fabrics are sequentially laminated between a pad of an integrated circuit (IC) chip and a main printed circuit board (PCB) of testing equipment, wherein the needle blocks have a plurality of needles installed therein, a plurality of probes, which correspond to the pads of the IC chip one by one, project at upper ends of the respective needles and probes, which correspond to the pads of circuit patterns of the complex textile fabrics one by one, project at lower ends of the needles. The complex textile fabric is characterized by being attached to the main PCB having pads with a larger pitch than that of the IC chip to form a circuitry, since a pan-out circuit pattern is formed on a surface of the complex textile fabric. |
