HEAT RADIATOR FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a heat radiator for an electronic component which deals with variations in mounting height and tolerance etc. occurred when components are packaged and improves heat transfer performance from the electronic component to a heat spreader.SOLUTION: In a heat radiator 1 for an electronic component, a CPU 3 installed on a substrate 2 is thermally connected with a heat sink 30 through a heat spreader 10. The heat spreader 10 includes multiple micro-fins 13 provided on an inner surface 11a facing the CPU 3. The micro-fins 13 are integrated with the heat spreader 10 and are formed so as to elastically deform while making a surface contact with the CPU 3.