PHENOLIC RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT USING SAME, COPPER-CLAD LAMINATE, AND SEMICONDUCTOR SEALING MATERIAL

摘要

The present invention addresses the problem of providing a novel phenolic resin that, when used as an epoxy resin curing agent, gives a cured product that exhibits excellent characteristics such as thermal resistance, moisture resistance, permittivity, and dielectric dissipation. The present invention additionally address the problem of providing: an epoxy resin composition containing the novel phenolic resin and an epoxy resin; a cured product of the epoxy resin composition; a copper-clad laminate in which the epoxy resin composition is used as a matrix resin; and a semiconductor sealing material that uses the epoxy resin composition. Provided are a phenolic resin that is represented by formula (1), an epoxy resin composition, and a cured product, a copper-clad laminate, and a semiconductor sealing material that use the epoxy resin composition.