| 发明名称 |
IMAGE PICKUP PANEL AND IMAGE PICKUP PROCESSING SYSTEM |
| 摘要 |
An image pickup panel (1) includes: photodetection sections (10) each including a photodetector (11-1) and a receiver (11-2) which are integrally molded and having solder bumps (12) formed thereon, the photodetector converting received light into a current signal, the. receiver converting the current signal into a voltage signal; and a wiring layer (20) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections. |
| 申请公布号 |
US2014326892(A1) |
申请公布日期 |
2014.11.06 |
| 申请号 |
US201214362240 |
申请日期 |
2012.12.07 |
| 申请人 |
Sony Corporation |
发明人 |
Ootorii Hiizu;Shirota Norihisa;Togashi Haruo |
| 分类号 |
G01T1/202;G01T1/20 |
主分类号 |
G01T1/202 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image pickup panel comprising:
photodetection sections each including a photodetector and a receiver which are integrally molded and having solder bumps formed thereon, the photodetector converting received light into a current signal, the receiver converting the current signal into a voltage signal; and a wiring layer including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections. |
| 地址 |
Tokyo JP |
