POLISHING PAD FOR MONITORING EDDY CURRENT

摘要

PROBLEM TO BE SOLVED: To provide a terminal point detection method which can stop polishing with high accuracy, can reduce excessive polishing and lack of polishing as well as cup-shaped deformation or erosion, and enhances a yield and throughput.SOLUTION: A chemical mechanical polishing apparatus comprises: a polishing pad 30; a carrier head 70 for holding a substrate 10 abutting on a first side of a polishing surface; and a motor coupled to at least one of the polishing pad 30 and the carrier head 70 for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in the proximity of the substrate 10. An optical monitoring system generates a light beam and detects reflection light of the light beam from the substrate 10. A controller receives signals from the eddy current monitoring system and the optical monitoring system.