| 发明名称 |
COMBINATION UNDERFILL-DAM AND ELECTRICAL-INTERCONNECT STRUCTURE FOR AN OPTO-ELECTRONIC ENGINE |
| 摘要 |
A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided. |
| 申请公布号 |
US2014328596(A1) |
申请公布日期 |
2014.11.06 |
| 申请号 |
US201214371537 |
申请日期 |
2012.01.31 |
| 申请人 |
Mathai Sagi Varghese;Ty Tan Michael Renne;Rosenberg Paul Kessler;Sorin Wayne Victor;Panotopoulos Georgios;Patra Susant K.;Straznicky Joseph |
发明人 |
Mathai Sagi Varghese;Ty Tan Michael Renne;Rosenberg Paul Kessler;Sorin Wayne Victor;Panotopoulos Georgios;Patra Susant K.;Straznicky Joseph |
| 分类号 |
H04B10/25;H01L31/02;H01L31/0203;H01L31/167 |
主分类号 |
H04B10/25 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine, said structure comprising:
a first plurality of electrical-interconnect solder bodies; wherein said first plurality of electrical-interconnect solder bodies comprises a plurality of electrical interconnects; and wherein said first plurality of electrical-interconnect solder bodies is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for said opto-electronic engine. |
| 地址 |
Berkeley CA US |
