发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of promptly adjusting a temperature of a process liquid in the middle of the substrate processing, and to provide a substrate processing method.SOLUTION: A substrate processing apparatus 1 according to one embodiment comprises: a support part 4 which supports a substrate W; a rotary mechanism 5 which rotates the support part 4 using a shaft, which intersects with the substrate W supported by the support part 4, as a rotation shaft; a nozzle 6 which supplies a process liquid to a surface of the substrate W on the support part 4 rotated by the rotary mechanism 5; a heater 8 which heats the substrate W supported by the support part 4 while being separated from the substrate W; and a movement mechanism 9 which moves the heater 8 toward and away from the substrate W supported by the support part 4. |
申请公布号 |
JP2014209582(A) |
申请公布日期 |
2014.11.06 |
申请号 |
JP20140048638 |
申请日期 |
2014.03.12 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
HAMADA KOICHI;KOBAYASHI NOBUO |
分类号 |
H01L21/304;G02F1/13;H01L21/027;H01L21/306 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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