发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of promptly adjusting a temperature of a process liquid in the middle of the substrate processing, and to provide a substrate processing method.SOLUTION: A substrate processing apparatus 1 according to one embodiment comprises: a support part 4 which supports a substrate W; a rotary mechanism 5 which rotates the support part 4 using a shaft, which intersects with the substrate W supported by the support part 4, as a rotation shaft; a nozzle 6 which supplies a process liquid to a surface of the substrate W on the support part 4 rotated by the rotary mechanism 5; a heater 8 which heats the substrate W supported by the support part 4 while being separated from the substrate W; and a movement mechanism 9 which moves the heater 8 toward and away from the substrate W supported by the support part 4.
申请公布号 JP2014209582(A) 申请公布日期 2014.11.06
申请号 JP20140048638 申请日期 2014.03.12
申请人 SHIBAURA MECHATRONICS CORP 发明人 HAMADA KOICHI;KOBAYASHI NOBUO
分类号 H01L21/304;G02F1/13;H01L21/027;H01L21/306 主分类号 H01L21/304
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