| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electrolytic copper plating solution which can suppress occurrence of anode sludge even when an electrolytic treatment is executed continuously in an electrolytic copper plating solution and is also effective for suppression of deterioration of brightener ingredients.SOLUTION: In an electrolytic copper plating solution for electrolysis with phosphorus-containing copper as the anode, an additive for the electrolytic copper plating solution with phosphorus-containing copper as the anode consists of at least one ingredient selected from alkenes and alkynes. The carbon atoms of the alkenes and alkynes are bonded to a number of substituents necessary for the binding valence selected from H, lower alkyl groups, the hydroxy group, the carboxyl group, -SOM, COONH, and so on.</p> |
