SILICON WAFER POLISHING COMPOSITION, AND METHOD IN CONNECTION THEREWITH

摘要

PROBLEM TO BE SOLVED: To provide a polishing composition for final polishing in order to reduce a silicon wafer surface defect.SOLUTION: Provided are a chemical mechanical polishing composition and a manufacturing method thereof. The chemical mechanical polishing composition comprises: water; a cation expressed by the formula (I); piperazine expressed by the formula (II) or a piperazine derivative; and as required, pH adjuster. The chemical mechanical polishing composition can achieve a silicon-removal rate of at least 300 nm/min.