SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIPATION FUNCTION

摘要

A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.

主权项

1. A semiconductor package comprising:
a substrate; a semiconductor chip located on a top surface of the substrate; signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom; a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another; barrier walls configured to contact the ground line unit; and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit comprises diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit comprises a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate.