发明名称 |
Ceramic substrate used for fabricating electric or electronic circuit |
摘要 |
<p>A ceramic substrate is used for an electric or electronic circuit comprises a ceramic plate (11) formed of a substance mainly composed of aluminum nitride, and conductive islands (12/13) formed of aluminum or an aluminum alloy and bonded to one surface of said ceramic plate for providing conductive paths to circuit components (16/17) connected thereto, wherein the aluminum or aluminum-alloy islands decrease the total weight of the ceramic substrate and enhance a resistance against repetition of a thermal stress. <IMAGE></p> |
申请公布号 |
EP1020914(A2) |
申请公布日期 |
2000.07.19 |
申请号 |
EP20000104809 |
申请日期 |
1990.10.08 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
YOSHIDA, HIDEAKI;KUROMITSU, YOSHIROU;TORIUMI, MAKOTO;YUZAWA, MICHIO |
分类号 |
H01L23/373;H01L23/498;H05K1/03;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H01L23/498;H01L21/48 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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