| 摘要 |
PROBLEM TO BE SOLVED: To reduce in size an image sensor module by effectively utilizing the dead space in the module. SOLUTION: The present invention relates to an image sensor module comprising a first wiring board which has a first surface and a second surface and in which a first wiring pattern having a first land is provided at a first surface side; a solid-state image sensor chip in which a functional surface having a photodetection part and a non-photodetection part including a terminal pad is provided on a side opposite to a side of the first wiring board and which is provided on the first surface of the first wiring board; a second wiring board which has a first surface and a second surface, in which a second wiring pattern having a second land is provided at a first surface side and a third wiring pattern having a third land is provided at a second surface side, in which the second surface side is turned toward a side of the solid-state image sensor chip and the third land is electrically connected with the terminal pad of the solid-state image sensor chip via a conductive pad, and which is provided on the non-photodetection part of the solid-state image sensor chip; and a connection member for electrically connecting the second land of the second wiring board and the first land of the first wiring board. COPYRIGHT: (C)2011,JPO&INPIT |
