发明名称 TEMPERATURE CONTROL APPARATUS AND FACILITY FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING THE SAME
摘要 <p>Disclosed are a temperature adjusting device and a semiconductor manufacturing facility having the same. The temperature adjusting device comprises: a plate; a heater block which is arranged inside or under the plate; a power supply unit which is arranged outside a chamber to provide power to the heater block; a contactless relay which is connected between the power supply unit and the heater block and adjusts the power; and a relay monitoring unit which detects overheating of the contactless relay and blocks the power when the overheating is detected.</p>
申请公布号 KR20140128083(A) 申请公布日期 2014.11.05
申请号 KR20130046791 申请日期 2013.04.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, IN SUNG
分类号 H01L21/205;H01L21/02 主分类号 H01L21/205
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