发明名称 |
TEMPERATURE CONTROL APPARATUS AND FACILITY FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING THE SAME |
摘要 |
<p>Disclosed are a temperature adjusting device and a semiconductor manufacturing facility having the same. The temperature adjusting device comprises: a plate; a heater block which is arranged inside or under the plate; a power supply unit which is arranged outside a chamber to provide power to the heater block; a contactless relay which is connected between the power supply unit and the heater block and adjusts the power; and a relay monitoring unit which detects overheating of the contactless relay and blocks the power when the overheating is detected.</p> |
申请公布号 |
KR20140128083(A) |
申请公布日期 |
2014.11.05 |
申请号 |
KR20130046791 |
申请日期 |
2013.04.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, IN SUNG |
分类号 |
H01L21/205;H01L21/02 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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