发明名称 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
摘要 <p>A composite structure 10 of a resin-diamagnetic material, including a diamagnetic material layer 12 and a resin layer 14 is obtained by a method including disposing particles of a diamagnetic material 22 and a resin 24 in a mold 30, applying a magnetic field to the diamagnetic material 22 disposed in the mold 30, and moving the diamagnetic material 22 in a direction away from at least a part of an inner surface of the mold 30, and then curing the resin 24 in the mold 30 thereby to produce a resin-diamagnetic material composite structure.</p>
申请公布号 JP5619830(B2) 申请公布日期 2014.11.05
申请号 JP20120161701 申请日期 2012.07.20
申请人 パナソニック株式会社 发明人 南尾 匡紀;氏原 大介;和田 浩
分类号 H01L23/36;H01L23/373;H05K7/20 主分类号 H01L23/36
代理机构 代理人
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