发明名称 THERMAL SURFACE TREATMENT FOR REUSE OF WAFERS AFTER EPITAXIAL LIFT OFF
摘要 There is disclosed a method of preserving the integrity of a growth substrate in a epitaxial lift-off method, the method comprising providing a structure comprising a growth substrate, one or more protective layers, a sacrificial layer, and at least one epilayer, wherein the sacrificial layer and the one or more protective layers are positioned between the growth substrate and the at least one epilayer; releasing the at least one epilayer by etching the sacrificial layer with an etchant; and heat treating the growth substrate and/or at least one of the protective layers.
申请公布号 KR20140128393(A) 申请公布日期 2014.11.05
申请号 KR20147024301 申请日期 2013.02.07
申请人 THE REGENTS OF THE UNIVERSITY OF MICHIGAN 发明人 LEE, KYU SANG;ZIMMERMAN JERAMY;FORREST STEPHEN R.
分类号 H01L31/18;H01L31/024 主分类号 H01L31/18
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