发明名称 半導電性ポリアミド系シームレスベルト
摘要 PROBLEM TO BE SOLVED: To provide a semi-conductive seamless belt in which creep resistance is improved by increasing an elastic modulus while maintaining toughness which is the characteristic of polyamide resin to stabilize resistance even in changes in temperature and humidity and voltage impression, and which is also excellent in electric characteristics. SOLUTION: The semi-conductive seamless belt is obtained of which the resistance is stabilized even in changes in temperature and humidity and voltage impression, and the electric characteristics are also excellent by compounding a plate-like inorganic filler of which the maximum diameter is 1 to 20μm, the thickness is 0.05 to 2μm, and the aspect ratio (maximum diameter/thickness) is 20 to 400 with aliphatic polyamide resin of which water absorption coefficient is 1.5% or below. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5618718(B2) 申请公布日期 2014.11.05
申请号 JP20100201165 申请日期 2010.09.08
申请人 发明人
分类号 G03G15/16 主分类号 G03G15/16
代理机构 代理人
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