Multi-part substrate assemblies for low profile portable electronic devices

摘要

Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact.

主权项

1. A portable electronic device, comprising:
a plurality of electrical components; a first printed circuit board including a plurality of distinct electrical conductors for interconnecting the electrical components being attached to the first printed circuit board, the first printed circuit board having a recessed portion; a second circuit board placed within the recessed portion and attached and operatively coupled to the first printed circuit board, wherein the recessed portion comprises a first recessed portion of a first depth, wherein the first printed circuit board comprises a second recessed portion having a second depth that is greater than the first depth, wherein the first recessed portion abuts a first edge of the printed circuit board, and wherein the second recessed portion abuts a second edge of the printed circuit board; and a third circuit board placed within the second recessed portion and attached and operatively coupled to the first printed circuit board, wherein the third circuit board extends from within the second recessed portion to beyond the second edge of the first printed circuit board, wherein a portion of the second circuit board overlaps the second recessed portion.