发明名称 CIRCUIT BOARD FOR LED
摘要 <p>The present invention relates to a circuit board for light emitting diode (LED). The circuit board for LED includes: a copper film laminating board (110) which has at least one penetration groove (114) and a circuit layer (113) formed at the outer edge of the penetration groove; a metal board (130) which adheres to the lower part of the copper film laminating board (110); a bonding sheet (120) which has a penetration groove (121) bigger than the penetration groove (114) at a position corresponding to the penetration groove (114) of the copper film laminating board (110) and attaches the two boards by being inserted into a part between the copper film laminating board (110) and the metal board (130); and an LED chip (140) which is mounted on the upper part of the metal board (130) exposed by the penetration groove (114) and is connected with the circuit layer (113) by a wire bonding (150). The present invention is able to improve luminous efficiency and heat radiation efficiency by attaching a PVD-coated metal board to the lower part of a circuit board which is formed in a penetration groove and mounting an LED chip on the metal board which corresponds to the penetration groove. The present invention is also able to prevent the dissolution of adhesive which attaches a circuit board to a metal board by the heat radiation of an LED chip mounted on the metal board by forming a space in the attached part between the circuit board and the metal board on a bonding sheet for attaching the circuit board to the metal board by forming a penetration groove which is bigger than a penetration groove formed on the circuit board.</p>
申请公布号 KR101457803(B1) 申请公布日期 2014.11.04
申请号 KR20130066915 申请日期 2013.06.12
申请人 LEE, CHANG HEE;BAK, DOO JIN 发明人 LEE, CHANG HEE;BAK, DOO JIN
分类号 H05K1/02;H01L33/00;H05K7/20 主分类号 H05K1/02
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